1

NEX E75

• Soft Spreadable Paste with Strong Adhesion, Easy Application
• Ultra Thin Interface Layer, Low Thermal Resistance
• Low Volatile Content, Long Lasting Stable Performance
• Safe Formula, Non Conductive and Non Corrosive
• Excellent Interface Bonding, Wide Device Compatibility
• Consistent Cooling Output Under Continuous Operation

2

MAX E72

• Reinforced Liquid Metal Composite, Outperforms Traditional Thermal Paste
• Ultra Low Thermal Resistance, Boost Heat Transfer Efficiency
• Excellent Micro Gap Filling, Maximize Surface Contact
• High Performance and Easy Application, Friendly for DIY Users
• Non Drying and Long Lasting Thermal Stability
• Included Intel AMD Protection Kit, Prevent Galvanic Corrosion

3

LUX E71

• Superior Thermal Conductivity
• Ultra-Low Thermal Resistance
• Max Core Temperature Reduction
• Perfect Surface Contact
• Long-Term Thermal Stability
• Enthusiast Grade for High Power Chips