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MAX E72

MAX E72

01

LIQUID METAL COMPOSITE ENHANCEMENT

Combines high thermal conductivity of liquid metal, exceeding limits of traditional thermal paste. MAX E72 thermal grease features a thermal conductivity of 8.0 W/m-K. Adopting a liquid metal composite enhanced formula, it breaks the performance bottleneck of conventional silicone thermal fillers and delivers significantly superior thermal transfer capability over ordinary thermal grease on the market.

LIQUID METAL COMPOSITE ENHANCEMENT LIQUID METAL COMPOSITE ENHANCEMENT
02

ULTRA-LOW THERMAL RESISTANCE

MAX E72 Thermal Grease delivers thermal resistance as low as 0.024 K-cm2/W. Boasts ultra-low interface thermal resistance, effectively reducing the contact thermal resistance between CPU/GPU dies and the cooler cold plate.

ULTRA-LOW THERMAL RESISTANCE ULTRA-LOW THERMAL RESISTANCE
03

EFFICIENT MICRO-GAP FILLING

Features excellent rheological gap-filling capability. It fully fills micro-pores and irregular gaps on contact surfaces, eliminates air insulation layers, expands the effective contact area, and greatly improves the actual thermal contact efficiency at hardware interfaces.

EFFICIENT MICRO-GAP FILLING EFFICIENT MICRO-GAP FILLING
04

HIGH PERFORMANCE WITH EASY APPLICATION

Compared with pure liquid metal, this modified composite formula features controllable fluidity. It is easier to spread, position and apply, lowering the barrier for DIY builders.

HIGH PERFORMANCE WITH EASY APPLICATION HIGH PERFORMANCE WITH EASY APPLICATION
05

LONG-LASTING, HEAT-RESISTANT & NON-DRYING

It maintains stable thermal performance across -40°C to 125°C, slows thermal grease aging and degradation, and reduces the frequency of frequent reapplication and maintenance.

LONG-LASTING, HEAT-RESISTANT & NON-DRYING LONG-LASTING, HEAT-RESISTANT & NON-DRYING
06

WIDE COMPATIBILITY

Suitable for multiple devices. Besides common CPU thermal-conducting applications, it also works for electronic products such as graphics cards, laptops and handheld game consoles.

WIDE COMPATIBILITY WIDE COMPATIBILITY

INCLUDE INTEL/AMD PROTECTIVE KITS

Prevents corrosion of PC components from liquid metal precipitation. Comes with a cleaning cloth to remove residual thermal paste on CPU/GPU surfaces for easy cleanup.

Compatibility

Product Size

Tech Specs

Technical specifications

ColorGrey
AppearancePaste
Thermal Conductivity8.0 W/m·K
Thermal Resistance0.024 cm²·K/W
Density5.0 g/cm³
Volume Resistivity
Breakdown Voltage
Operating Temperature Range-40~125 ℃
Volatility (200℃, 24h)
Average viscosity
CorrosiveDo not come into direct contact with aluminum and its alloys.
Packaging specifications2g±0.2g


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