LUX E71 delivers thermal conductivity up to 26 W/m-K. Its thermal conductivity far exceeds traditional thermal paste, greatly reducing TIM thermal resistance. Positioned above ordinary thermal paste, it is ideal for flagship CPUs, GPUs, water cooling and extreme performance enthusiasts.
LUX E71 delivers thermal resistance as low as 0.01K-cm2/W. Liquid metal forms a thinner, continuous thermal interface to reduce contact resistance between the chip and cold plate.
Stable operation from -50°C to 600°C. Resists extreme temperatures for extended service life.
Its liquid form fully fills microscopic irregularities and gaps between CPU/GPU and cold plate.
Lowers CPU/GPU core temperature. Ideal for high-power, high-heat processors and overclocking scenarios.
Intel/AMD protective kit included as standard, preventing PC component corrosion caused by liquid metal precipitation. Comes with a cleaning cloth to remove residual thermal paste on CPU/GPU surfaces for easy cleanup.
| Color | Silver |
| Appearance | Paste |
| Thermal Conductivity | 26 W/m·K |
| Thermal Resistance | 0.01 cm²·K/W |
| Density | 6.2±0.2 g/cm³ |
| Volume Resistivity | |
| Breakdown Voltage | |
| Operating Temperature Range | -40～150 ℃ |
| Volatility (200℃, 24h) | ≦0.001% |
| Melting Point | 15.5±1 °C |
| Average viscosity | |
| Corrosive | Do not come into direct contact with aluminum and its alloys. |
| Packaging specifications | 1±0.1 g |
Official review materials and downloadable product documents.
