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NEX E75

NEX E75

01

FAST HEAT DISSIPATION

NEX E75 Thermal Grease features a thermal conductivity of 3.5 W/m-K. Adopting nano-molecular technology, it uses nanoparticles to achieve excellent thermal conductivity and heat transfer across all processed components.

FAST HEAT DISSIPATION FAST HEAT DISSIPATION
02

ULTRA-LOW THERMAL RESISTANCE

NEX E75 Thermal Grease delivers thermal resistance as low as 0.05 K-cm2/W. It features lower thermal resistance compared with ordinary thermal greases and maintains stable thermal conduction under extreme operating conditions ranging from -40 °C to 250 °C.

ULTRA-LOW THERMAL RESISTANCE ULTRA-LOW THERMAL RESISTANCE
03

INSULATING & NON-CORROSIVE

Formulated with special silicone raw materials, it achieves an ultra-thin interface thickness of 15 um @40 psi for enhanced heat transfer efficiency. Its non-conductive, non-corrosive formulation prevents damage to metal surfaces, resists solidification, and maintains outstanding performance over long-term use.

INSULATING & NON-CORROSIVE INSULATING & NON-CORROSIVE
04

WIDE COMPATIBILITY

Suitable for multiple devices. Besides common CPU thermal-conducting applications, it also works for electronic products such as graphics cards, laptops and handheld game consoles.

WIDE COMPATIBILITY WIDE COMPATIBILITY

COMES WITH SPATULA & CLEANING CLOTH

Effectively removes residual thermal grease from CPU/GPU surfaces. Wipe lightly for an instant like-new condition.

Compatibility

Product Size

Tech Specs

Technical specifications

ColorGrey
AppearancePaste
Thermal Conductivity3.5 W/m·K
Thermal Resistance0.05 cm²·K/W
Density2.6 g/cm³
Volume Resistivity1.35×1011 Ω·m
Breakdown Voltage1.3 KV/mm
Operating Temperature Range-40~125 ℃
Volatility (200℃, 24h)0.0041
Average viscosity800 Pa·s
CorrosiveNone
Packaging specifications5g±0.2g


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