FAST HEAT DISSIPATION
NEX E75 Thermal Grease features a thermal conductivity of 3.5 W/m-K. Adopting nano-molecular technology, it uses nanoparticles to achieve excellent thermal conductivity and heat transfer across all processed components.
NEX E75 Thermal Grease features a thermal conductivity of 3.5 W/m-K. Adopting nano-molecular technology, it uses nanoparticles to achieve excellent thermal conductivity and heat transfer across all processed components.
NEX E75 Thermal Grease delivers thermal resistance as low as 0.05 K-cm2/W. It features lower thermal resistance compared with ordinary thermal greases and maintains stable thermal conduction under extreme operating conditions ranging from -40 °C to 250 °C.
Formulated with special silicone raw materials, it achieves an ultra-thin interface thickness of 15 um @40 psi for enhanced heat transfer efficiency. Its non-conductive, non-corrosive formulation prevents damage to metal surfaces, resists solidification, and maintains outstanding performance over long-term use.
Suitable for multiple devices. Besides common CPU thermal-conducting applications, it also works for electronic products such as graphics cards, laptops and handheld game consoles.
Effectively removes residual thermal grease from CPU/GPU surfaces. Wipe lightly for an instant like-new condition.
| Color | Grey |
| Appearance | Paste |
| Thermal Conductivity | 3.5 W/m·K |
| Thermal Resistance | 0.05 cm²·K/W |
| Density | 2.6 g/cm³ |
| Volume Resistivity | 1.35×1011 Ω·m |
| Breakdown Voltage | 1.3 KV/mm |
| Operating Temperature Range | -40~125 ℃ |
| Volatility (200℃, 24h) | 0.0041 |
| Average viscosity | 800 Pa·s |
| Corrosive | None |
| Packaging specifications | 5g±0.2g |
Official review materials and downloadable product documents.